JPL (Reflow Oven)

The model RF-630 is a small Reflow Soldering Machine corresponding to lead-free soldering and using infrared radiation for the basic heating. While this is a small table-top reflow machine, it a method with six far infrared (IR) zones, and the precise and stable temperature profile required for lead-free reflow soldering can be obtained. By use of far infrared radiation, the various requirements for lead-free soldering can be met sufficiently. A max. temperature of 350°C and solder wettability are realized.

Links : http://www.jpl.com/products/smt/#reflow