Signup for our newsletter to get notified about sales and new products.
Bond testing plays a very important role in the semiconductor packaging industry. Our equipment performs shear tests to access die bonding, and pull tests on wire and ball bonds.
Your Name (required)
Your Email (required)
There are no reviews yet.
You must be logged in to post a review.
Failure Analysis Tools
EDS, WDS, EBSD, Micro-XRF and Micro-CT
Plastic Mold Decapsulation System