Comprehensive Measurements for HDI-PCB Production
Incorporating over ten years of packaging metrology expertise, the ContourSP Large Panel Metrology System more than doubles the measurement throughput of high-density interconnect PCB (HDI-PCB) substrates over previous generation SP models. The ContourSP is specifically designed to measure each layer of the PCB panels during manufacturing, and incorporates a host of advanced features that deliver utmost production performance, convenience, reliability, and throughput for the semiconductor packaging industry.
The gage-capable ContourSP utilizes an intuitive production interface that offers fast and easy fiducial alignment with configurable user input. Only ContourSP can assure minimum recipe development time, highest yield, maximum uptime, and lowest cost per measured panel in production.