NSC Mechanical Decapsulation System BA102
- 3 capabilities:
- Cross sectioning/ polishing
- Surface Grinding / polishing
- Cutting out
- 2 cameras attached to observe samples from different angles. Process area can be easily defined on sample image displayed
- Diamond blade used for cross-sectioning. Polishing blade and diamond liquid used for polishing a cross-sectioned surface
- End mill is used for grinding of molding compound and metal. Diamond bit is used for grinding Silicon and diamond paste is used for backside polishing. Suitable for OBIRCH, Emission, and LIT analysis as the system allows backside processing without damaging leads.
- System is capable of thinning Silicon to less that 50µm thickness, observation of wiring layers of PCB and thinning thick samples to right above wires before wet-etch process, reducing wet-etch cycle-time and acid consumption.
- End mill can extract out any part mounted on PCB, removal of metal cap and taking bare chip out from packages
