Optotherm Sentris, Electronics Failure Analysis System
Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.
Faults Detected:
- Semiconductor ESD related faults
- Leakage current and hot spots
- Resistive shorts between gate and drain
- Shorts in mold compound of packaged devices
- Latch-up sites
- Shorts in metallization
- Defective transistors and diodes
- Oxide layer breakdown
- SMD component leakage
Features and Capabilities:
- High sensitivity lock-in thermography fault isolation
- identify the x, y location of defects. Additionally, fault depth can also be determined by analyzing the phase angle (or time delay) between voltage application and resulting surface heating.
- Defect depth analysis of stacked die
- True temperature mapping using Emissivity Tables
- method to accurately measurement temperature of the junction by compensating for pixel emissivity variations across the die surface.
- Visual camera probing
- Junction temperature measurement
- Bare and packaged device analysis
- Front and backside analysis
- Detection of die attach problems
- assess the heat flow to determine integrity die bond integrity.
- Thermal resistance evaluation
- provides accurate temperature measurements at thermal reference points, such as device packaging and heat sinks, to evaluate thermal resistance.
