Bruker 3D Optical Profiler ContourSP
- ContourSP Large Panel Metrology System more than doubles the measurement throughput of high-density interconnect PCB (HDI-PCB) substrates over previous-generation WLI instruments
- Specifically designed to measure each layer of the PCB panels during manufacturing, and incorporates a host of advanced features that deliver utmost production performance, convenience, reliability, and throughput for the semiconductor packaging industry
- Gauge-capable ContourSP utilizes an intuitive production interface that offers fast and easy fiducial alignment with configurable user input
