SBT Ultrasonic Die Bonder SDB-200
- Compatible with various processes, incl cold bonding, thermal bonding, adhesive attachment, flip chip mounting, etc.
- Supports precise pick-and-place and flip-chip mounting for wafers
- Supports innovative processes such as diversification, miniaturization, thinning and multi-layering.
- Capable of process changes through tool replacement.
- Used for assembly of high-value-added components, like RF modules, SAWs, MEMs, actuators, sensors, etc.
| Dimension of Machine | 970mm (W) x 1800mm(D) x 1550mm (H) | |
| Dimension of Water Tank | 650mm x 1500mm x 150mm (Customizable) | |
| Scanning Range | 400mm x 320mm (Customizable) | |
| Maximum Scanning Speed | 2000mm/s , adjustable | |
| Transducers | Two Transducers from 1 ~ 230MHz |
