Leica EM TIC 3X Ion Beam Milling System
Allows production of cross sections and planar surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations.
- Cuts high-quality cross-sections with large areas of 4 > 1 mm
- Configurations: Rotary stage, multi sample stage, standard stage, cooling stage, vacuum cyro transfer docking.
- Multiple sample stage capable of processing several samples in one run
- Samples up to a size of 50 x 50 x 10 mm or up to 38 mm diameter can be inserted for processing
- Easy and accurate sample mounting and alignment
- Simple operation via touch-screen, no special skills necessary
- Process monitoring via stereomicroscope or HD-TV camera
- Four segment-controlled LED illumination for optimal specimen viewing and alignment
- Integrated, decoupled roughing pump provides vibration-free observation
- Contrast enhancement at 90° to the prepared surface
- Usable for almost any material, cooling stage provides temperatures of mask and sample down to -160 °C
- Parameter and program upload and download on USB stick
- Total workflow solution saves user interaction time
