MVP 2030 Integrated Loader/ Unloader
Features and Capabilities:
- Highest Units per hour in the Industry
- High accuracy and highly reliable fully integrated material handling
- Multiple defect handling options incl: ink marking, wire ripping, punch, XML map
- Leading defect detection:
- Au, AI, Ag and Cu Wires
- Wedge, ball & Stitch bonds
- Crescent, ribbon and tape bonds
- Die placement, die surface & edge damage
- Epoxy flow & spread
- Foreign objects & scratches
- Class 100 clean room option
| 2030 + Option | +LP15 | +LP7 | + Micro |
|---|---|---|---|
| Programming Speed | Enhanced tools to allow you to generate programs with/without CAD | ||
| Motion system X and Y | Precision X/Y Stage with 0.5-micron positional resolution | ||
| Optical resolution | Options from 0.3-5µm | ||
| 3D Measuring principle | Laser Profiler | Laser Profiler | Microscopic |
|
3D max scan speed (cm/s) (dependent on camera & lens configurations) |
2.4 | 0.5 | Application Dependent |
| 3D sensor X-Y Resolution (um) | 5 | 2.5 | 250-350nm |
| 3D sensor Z Repeatability (um) | 0.5 | 0.3 | 0.5 |
| Max component height | 35 | ||
