MVP 900 Modular

Modular AOI inspection platform provides a range of advanced optic and handling solutions including 3D, high resolution imaging and quad color lighting.
MVP 900 W – (Wafer 100-300mm)
Manually Loaded Wafer Inspection

  • Surface inspection
  • Bump inspection
  • Support for 100,150,200 and 300mm wafers
MVP 900 ALW – (Wafer 100-300mm)
Automatically Loaded

  • Surface, Bump inspection
  • Support for 100,150,200 and 300mm wafers
  • 3rd Party Handlers SMIF, FOUP
MVP 900 DW – (Film Frame- Diced Wafer)
Manually Loaded Diced Wafer Inspection

  • Surface/ Edge inspection
  • Bump inspection
  • Support for up-to 15” frames
MVP 900 ADW – (Film Frame – Diced Wafer)
Automatically Loaded from Cassette

  • Surface inspection
  • Bump inspection
  • Support for up to 15” Frames with Flipper
Configurations MVP 900 DWMS – Die Wire Metrology
Automatic Load from Magazine Loaders

  • Lead- Frame Inspection
  • Die/Wire Inspection
  • Highest throughput
  • Defect Marking
MVP 900 Mil- Spec – Die and Wire
In-Line or Manual Load

  • Wire Bond inspection
  • 1.67µm resolution
  • Laser Profiler for Loop Height
  • RF Module Inspection
  • Mil – Spec 883
MVP 900 AMS – (Automotive Focused)
In-Line or Manual Load

  • Wedge Bond inspection
  • Highest Throughput
  • Laser Profiler for Loop Height
  • Full module traceability with AutoData
MVP 900 T and 900 TS – In Tray Inspection
Loaded from Tray Stacker or In-Line

  • Available Part Sorter (TS) BGA Inspection
  • Die Inspection
  • JEDEC, Auer, Waffle Tray Support