MVP Versa 3D Automated Optical Inspection (AOI)
Combining 3D technology and MVP’s color detection to detect complex defects with advanced visualization. It is flexible for SPI, Pre-reflow, Post-reflow or Post-Wave inspection
- Solder Paste Inspection (SPI) and Surface Mount Technology (SMT) inspection
- Measurement based AOI
- High throughput with proven reliable hardware
- 01005 solder joint inspection
| Version | SPI – LP35 | SMT – MP24 | Plus – LP15 |
|---|---|---|---|
| Programming Speed | Standard SPI & AOI programs generated in 10-30 mins | ||
| Motion system X and Y | Precision X/Y Stage with 0.5-micron positional resolution | ||
| Optical resolution | Options from 5 – 20µm | ||
| 3D Measuring principle | Laser Profiler | Quad Moire | Laser Profiler |
| 3D max scan speed (cm/s) (Dependent on camera & lens configurations) |
14 | 10 | 2.2 |
| 3D sensor X-Y Resolution (um) | 12.5 | 7.8 | 5 |
| 3D sensor Z Repeatability (um) | 0.5 | 1 | 0.4 |
| Max component height | 35 | ||
