NSC Laser Decapsulation System PL201-20/ PL211
- By removing epoxy molding compound by laser, acid consumption and decap time with acid or plasma can be greatly reduced.
- Equipped with 20W fiber laser, and capable of cross-sectioning packages and cutting out IC on PCB
- PL221 comes with larger chamber with 397x170mm stage
- Lower cost as system price is reduced due to a cost reduction on the laser unit
- High power laser can be used with less damage on bonding wires, decap speed greatly improved
- Safe and Clean design:
- class 1 laser product,
- high-resolution real-time imaging during decap process
- signal tower to visually confirm operation status
- key switch/ laser safety interlock
- User-friendly software by simply selecting pre-set laser condition or user can set decap area by mouse drag or numerical input.
- Clear images: 5 mega-pixel camera with 25mm lens (FOV: 45 x 33mm) with digital zoom capability
