NSC Plasma Decapsulation System MP101
IC package decapsulation system which decomposes molding compound utilizing O2 plasma generated by atmospheric microwave plasma needle.
- Chip can be exposed in several hours. (Etch time varies depending on the type of molding compound and device structure)
- O2 plasma decap is suitable for functionality analysis as it has less damage to lower passivation layers.
- System is very compact without a vacuum pump as O2 plasma is generated in an atmospheric condition
- Eco-friendly system which utilizes Argon and Oxygen only for plasma generation, and water for cleaning. Acid use and disposal is no longer required.
- Silica filler removal process (Ultrasonic cleaning & Drying) is fully automated.
- Decap result: No wire thinning, no characteristic change before and after decap process.
