NSC Plastic Mold Decapsulation System PS103S
- Setting Temperature range for Acid: Room Temp to 250 °C
- Usable acid: Fuming Nitric, Sulfuric, Fuming Sulfuric and Mixed Acid
Decapped Samples:
- Etchant is blown up by N2 gas to etch IC mold compound:
- Any size of sample can etch with satisfactory result
- Acid consumption will be very much reduced (about 1/3 to ½ compared to other models)
- For Cu wire IC, lower temperature acid is necessary to avoid damage, which PS103S can achieve
- User friendly procedure: setting is by decapsulation time and cancellation is easily available during the operation.
