SBT Ultrasonic Die Bonder SDB-300
- Compatible with various processes, incl cold bonding, thermal bonding, adhesive attachment, flip chip mounting, etc.
- Supports precise pick-and-place and flip-chip mounting for wafers
- Supports innovative processes such as diversification, miniaturization, thinning and multi-layering.
- Capable of process changes through tool replacement.
- Used for assembly of high-value-added components, like RF modules, SAWs, MEMs, actuators, sensors, etc.
| Accuracy | ±10μm@3σ (TCB/ Ultrasonic Die Bonding) | |
| UPH | 1.32 sec (standard, pick & place | |
| Bonding Force | 10 ~ 2000 gf (Cold Bonding)/ 2 ~ 300N (TCB/ Ultrasonic Die Bonding) | |
| Bonding Area | 300mm (x) * 220mm (y) * 60mm(z), resolution: 0.1μm | |
| Dimension of Machine | 1300mm (W) * 1600mm (D) * 1750mm (H) |
